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1/11 tda7266sa september 2003 n wide supply voltage range (3.5-18v) n minimum external components C no swr capacitor C no bootstrap C no boucherot cells C internally fixed gain n stand-by & mute functions n short circuit protection n thermal overload protection description the tda7266sa is a dual bridge amplifier specially designed for lcd monitor, pc motherboard, tv and portable radio applications. pin to pin compatible with: tda7266s, tda7266, tda7266m, TDA7266MA, tda7266b, tda7297sa & tda7297. clipwatt15 ordering number: tda7266sa 7w+7w dual bridge amplifier block and application diagram 1 2 4 vref st-by 7 in1 0.22 m f v cc 13 3 d94au175b + - - + out1+ out1- 15 14 12 mute 6 in2 0.22 m f + - - + out2+ out2- 8 9 s-gnd pw-gnd 470 m f 100nf technology bi20ii
tda7266sa 2/11 absolute maximum ratings thermal data pin connection (top view) symbol parameter value unit v s supply voltage 20 v i o output peak current (internally limited) 2 a p tot total power dissipation (t amb = 70c) 20 w t op operating temperature 0 to 70 c t stg, t j storage and junction temperature -40 to 150 c symbol parameter value unit r th j-case thermal resistance junction-case typ = 1.8; max. = 2.5 c/w r th j-amb thermal resistance junction-ambient 48 c/w electrical characteristcs (v cc = 11v, r l = 8 w , f = 1khz, t amb = 25c unless otherwise specified) symbol parameter test condition min. typ. max. unit v cc supply range 3 11 18 v i q total quiescent current 50 65 ma v os output offset voltage 120 mv p o output power thd 10% 6.3 7 w thd total harmonic distortion p o = 1w 0.05 0.2 % p o = 0.1w to 2w f = 100hz to 15khz 1% svr supply voltage rejection f = 100hz, vr =0.5v 40 56 db ct crosstalk 46 60 db a mute mute attenuation 60 80 db t w thermal threshold 150 c g v closed loop voltage gain 25 26 27 db d g v voltage gain matching 0.5 db 1 2 3 4 5 6 7 9 10 11 8 n.c. n.c. s-gnd pw-gnd out2+ out2- vcc in2 st-by mute n.c. in1 v cc out1- out1+ d03au1463 13 14 15 12
3/11 tda7266sa application suggestion stand-by and mute functions (a) microprocessor application in order to avoid annoying "pop-noise" during turn-on/off transients, it is necessary to guarantee the right st- by and mute signals sequence. it is quite simple to obtain this function using a microprocessor (fig. 1 and 2). at first st-by signal (from m p) goes high and the voltage across the st-by terminal (pin 7) starts to increase ex- ponentially. the external rc network is intended to turn-on slowly the biasing circuits of the amplifier, this to avoid "pop" and "click" on the outputs. when this voltage reaches the st-by threshold level, the amplifier is switched-on and the external capacitors in series to the input terminals (c3, c53) start to charge. it's necessary to mantain the mute signal low until the capacitors are fully charged, this to avoid that the device goes in play mode causing a loud "pop noise" on the speakers. a delay of 100-200ms between st-by and mute signals is suitable for a proper operation. figure 1. microprocessor application r i input resistance 25 30 k w vt mute mute threshold for v cc > 6.4v; vo = -30db 2.3 2.9 4.1 v for v cc < 6.4v; vo = -30db v cc /2 -1 v cc /2 -075 v cc /2 -0.5 v vt st-by st-by threshold 0.8 1.3 1.8 v i st-by st-by current v6 = gnd 100 m a e n total output voltage a curve; f = 20hzto 20khz 150 m v electrical characteristcs (continued) (v cc = 11v, r l = 8 w , f = 1khz, t amb = 25c unless otherwise specified) symbol parameter test condition min. typ. max. unit 1 2 4 vref st-by 7 in1 c1 0.22 m f v cc 13 3 d95au258a + - - + out1+ out1- 15 14 12 mute 6 in2 c3 0.22 m f + - - + out2+ out2- 8 9 s-gnd pw-gnd c5 470 m f c6 100nf r1 10k c2 10 m f m p r2 10k c4 1 m f
tda7266sa 4/11 figure 2. microprocessor driving signals b) low cost application in low cost applications where the m p is not present, the suggested circuit is shown in fig.3. the st-by and mute terminals are tied together and they are connected to the supply line via an external voltage divider. the device is switched-on/off from the supply line and the external capacitor c4 is intended to delay the st-by and mute threshold exceeding, avoiding "popping" problems. +v s (v) v in (mv) v st-by pin 7 i q (ma) st-by mute play mute st-by 1.8 0.8 v mute pin 6 4.1 2.3 off off d96au259mod v out (v) 2.9 1.3
5/11 tda7266sa figure 3. stand-alone low-cost application 1 2 4 vref st-by 7 in1 c3 0.22 m f v cc 13 3 d95au260a + - - + out1+ out1- 15 14 12 mute 6 in2 c5 0.22 m f + - - + out2+ out2- 8 9 s-gnd pw-gnd c1 470 m f c2 100nf r1 47k c4 10 m f r2 47k figure 4. distortion vs frequency figure 5. gain vs frequency 0.010 0.1 1 10 100 1k 10k 20k thd(%) vcc = 11 v rl = 8 ohm pout = 100mw pout = 2w fr eque nc y (hz) -5.000 -4.000 -3.000 -2.000 -1.000 0.0 1.0000 2.0000 3.0000 4.0000 5.0000 10 100 1k 10k 100k level(db r) vcc = 11v rl = 8 ohm po ut = 1w frequency (hz)
tda7266sa 6/11 figure 6. mute attenuation vs vpin.8 figure 7. stand-by attenuation vs vpin 9 figure 8. quiescent current vs supply voltage 11.522.533.544.55 0 10 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 attenua tion (db) vpin .6(v) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 0 10 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 at tenua ti on (db) vpin.7 (v) 3456789101112131415161718 30 35 40 45 50 55 60 65 70 iq (ma ) vsupp ly(v)
7/11 tda7266sa figure 9. pc board component layout figure 10. evaluation board top layer layout figure 11. evaluation board bottom layer layout
tda7266sa 8/11 heat sink dimensioning: in order to avoid the thermal protection intervention, that is placed approximatively at t j = 150c, it is important the dimensioning of the heat sinker r th (c/w). the parameters that influence the dimensioning are: C maximum dissipated power for the device (p dmax ) C max thermal resistance junction to case (r th j-c ) C max. ambient temperature t amb max C quiescent current i q (ma) example: v cc = 11v, r load = 8ohm, r th j-c = 2.5 c/w , t amb max = 50c p dmax = (n channels) p dmax = 2 ( 3.0 ) + 0.5 = 6.5 w (heat sinker) in figure 12 is shown the power derating curve for the device. figure 12. power derating curve v cc 2 p 2 r load 2 -------------- -------------------------- - i q v cc + r th c-a 150 t amb max C p d max ---------------------------------------- - r th j-c C 150 50 C 6.5 ---------------------- 2.5 C 12.8 c/w === a) infinite heatsink b) 7 c/ w c) 10 c/ w (c) (a) (b) 0 5 10 15 20 25 0 40 80 120 160 tamb (c) pd (w) a) infinite heatsink b) 7 c/ w c) 10 c/ w (c) (a) (b) 0 5 10 15 20 25 0 40 80 120 160 tamb (c) pd (w)
9/11 tda7266sa clipwatt assembling suggestions the suggested mounting method of clipwatt on external heat sink, requires the use of a clip placed as much as possible in the plastic body center, as indicated in the example of figure 13. a thermal grease can be used in order to reduce the additional thermal resistance of the contact between pack- age and heatsink. a pressing force of 7 - 10 kg gives a good contact and the clip must be designed in order to avoid a maximum contact pressure of 15 kg/mm2 between it and the plastic body case. as example , if a 15kg force is applied by the clip on the package , the clip must have a contact area of 1mm2 at least. figure 13. example of right placement of the clip
tda7266sa 10/11 outline and mechanical data 0044538 dim. mm inch min. typ. max. min. typ. max. a 3.2 0.126 b 1.05 0.041 c 0.15 0.006 d 1.55 0.061 e 0.49 0.55 0.019 0.022 f 0.67 0.73 0.026 0.029 g 1.14 1.27 1.4 0.045 0.050 0.055 g1 17.57 17.78 17.91 0.692 0.700 0.705 h1 12 0.480 h2 18.6 0.732 h3 19.85 0.781 l 17.95 0.707 l1 14.45 0.569 l2 10.7 11 11.2 0.421 0.433 0.441 l3 5.5 0.217 m 2.54 0.100 m1 2.54 0.100 clipwatt15 weight: 1.92gr
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners ? 2003 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states www.st.com 11/11 tda7266sa

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